Method for providing an electrical connection

ABSTRACT

A preferred method for electrically connecting a first and a second component includes inserting a wire pin through a through hole formed in the first component so that a first portion of the wire pin is located within the through hole and a second portion of the wire pin is located within a retaining feature formed at least in part by the second component. The preferred method also includes moving one of the first and the second components in relation to the other of the first and the second components so that the wire pin resiliently deflects thereby establishing a first contact force between the first portion of the wire and the first components and a second contact force between the second portion of the wire and the second component.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a divisional of application Ser. No. 10/813,841, filed Mar. 31,2004, the entirety of which is incorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates to a method for electricallyinterconnecting two or more components.

BACKGROUND OF THE INVENTION

Manufactured products that perform electrical functions often includetwo or more electrically-connected components such as circuit boards,displays, external connections, etc. The electrical connection betweencomponents is typically achieved using techniques such as soldering (orother conduction reflow processes); flexible wires with connectorsattached to the ends thereof; flexible printed circuits equipped withspecial connectors or electrically-conductive adhesive; rigid pins andreceptacles; arrays of springs mounted in a housing clamped between theelectrically-connected components; etc.

The above-noted techniques can present disadvantages. For example, theprocess of installing flexible wires between two electrical componentscan be difficult to automate. Other techniques can more readily beautomated. Achieving such automation, however, can be relativelyexpensive, and may not be cost-effective in low-volume production runs.Moreover, electrical connections that incorporate solder or adhesive canmake it difficult to disassemble the interconnected components. Theformation of solder connections can introduce process variables thatmust be closely controlled, thereby increasing the complexity and costof the assembly process.

SUMMARY OF THE INVENTION

A preferred method for electrically connecting a first and a secondcomponent comprises inserting a wire pin through a through hole formedin the first component so that a first portion of the wire pin islocated within the through hole and a second portion of the wire pin islocated within a retaining feature formed at least in part by the secondcomponent.

A preferred method also comprises moving one of the first and the secondcomponents in relation to the other of the first and the secondcomponents so that the wire pin resiliently deflects therebyestablishing a first contact force between the first portion of the wirepin and the first component, and a second contact force between thesecond portion of the wire pin and the second component.

Another preferred method for electrically connecting a first and asecond component comprises substantially aligning a first through holeformed in the first component with one of a second through hole formedin the second component and a pocket formed at least in part by thesecond component, and inserting a wire pin through the first throughhole in a first direction so that a first portion of the wire pin islocated within the first through hole and a second portion of the wirepin is located within one of the second through hole and the pocket

A preferred method also comprises moving one of the first and the secondcomponents in a second direction in relation to the other of the firstand the second components, the second direction being substantiallyperpendicular to the first direction, thereby causing one of the firstand second portions of the wire pin to move in relation to the other ofthe first and second portions of the wire pin.

A preferred method for establishing electrical contact between a firstand a second component comprises substantially aligning a firstretaining feature defined at least in part by the first component with asecond retaining feature defined at least in part by the secondcomponent so that the first and second retaining features can eachreceive a respective portion of a wire pin.

A preferred method also comprises substantially misaligning the firstand second retaining features after the first and second retainingfeatures have each received the respective portions of the wire pin sothat the first and second components bend the wire pin and therebyestablish contact forces between the first component and the wire pin,and the second component and the wire pin.

Another preferred method for electrically connecting a first and asecond component comprises inserting a wire pin through a firstretaining feature formed at least in part by the first component so thata first portion of the wire pin is located within the first retainingfeature and a second portion of the wire pin is located within aretaining feature formed at least in part by the second component.

A preferred method also comprises moving one of the first and the secondcomponents in relation to the other of the first and the secondcomponents so that the first component engages the first portion of thewire pin by way of the first retaining feature, and the second componentengages the second portion of the wire pin by way of the secondretaining feature thereby causing the first portion of the wire pin tomove in relation to the second portion of the wire pin and bending thewire pin.

A preferred method for electrically connecting a first, a second, and athird component comprises inserting a wire pin through respectivethrough holes formed in the first and second components so that a firstportion of the wire pin is located within the through hole formed in thefirst component, a second portion of the wire pin is located within thethough hole formed in the second component, and a third portion of thewire pin is located in a retaining feature formed at least in part bythe third component.

A preferred method also comprises moving the second component inrelation to the first and the third components so that the wire pinresiliently deflects thereby establishing a first contact force betweenthe first portion of the wire pin and the first component, a secondcontact force between the second portion of the wire pin and the secondcomponent, and a third contact force between the third portion of thewire pin and the third component.

A preferred embodiment of an electrical energy meter comprises a basefor mounting on a supporting surface, and a current sensor assemblycomprising a plurality of contact blades extending through the base forelectrically contacting a conductor of electrical energy, and a currenttransformer mechanically coupled to the base and electrically coupled tothe contact blades. The current transformer produces an electricaloutput proportional to an electrical current in the conductor ofelectrical energy.

A preferred embodiment also comprises a printed circuit board forcalculating a cumulative amount of electrical energy passing through theconductor of electrical energy based on the electrical output of thecurrent transformer and a voltage of the conductor of electrical energy,and a contact blade electrically coupled to the printed circuit board bya wire pin.

The wire pin engages retaining features defined at least in part by therespective printed circuit board and contact blade. The retainingfeatures are substantially misaligned so that the wire pin is bent andcontact forces are thereby established between the wire pin and theprinted circuit board, and between the wire pin and the contact blade.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing summary, as well as the following detailed description ofa presently-preferred embodiment, is better understood when read inconjunction with the appended diagrammatic drawings. For the purpose ofillustrating the invention, the drawings show an embodiment that ispresently preferred. The invention is not limited, however, to thespecific instrumentalities disclosed in the drawings. In the drawings:

FIG. 1 is an exploded perspective view of an electrical-energy meterhaving a printed circuit board (PCB) and a contact blade that can beelectrically connected in accordance with a preferred method inaccordance with the present invention;

FIG. 2A is a cross-sectional side view of a PCB, a contact blade, a PCBhousing, a base, and a wire pin of the electrical-energy meter shown inFIG. 1, with the wire pin about to be inserted through the PCB and thePCB housing;

FIG. 2B is a cross-sectional side view of the PCB, contact blade, PCBhousing, base, and wire pin shown in FIG. 2A, after the wire pin hasbeen inserted through the PCB and the PCB housing and into a pocket ofthe base;

FIG. 2C is a cross-sectional side view of the PCB, contact blade, PCBhousing, base, and wire pin shown in FIGS. 2A and 2B, after the PCB andPCB housing have been moved laterally in relation to the base andcontact blade;

FIG. 2D is a cross-sectional side view of the PCB, contact blade, PCBhousing, base, and wire pin shown in FIGS. 2A-2C, after the PCB and PCBhousing have been further moved laterally in relation to the base andcontact blade to bend the wire pin;

FIG. 3A a cross-sectional side view of a first and a second PCB, a firstand a second PCB housing, and a wire pin of an alternative embodiment ofthe electrical-energy meter shown in FIGS. 1-2D, after the wire pin hasbeen inserted through the first PCB housing and the first and secondPCBs;

FIG. 3B is a cross-sectional side view of the first and second PCBs,first and second PCB housings, and wire pin shown in FIG. 3A, after thefirst PCB and first PCB housing have been moved laterally in relation tothe second PCB and PCB housing to bend the wire pin;

FIG. 4A is a cross-sectional side view of a first and a second PCB, aPCB housing, a base, a contact blade, and a wire pin of an alternativeembodiment of the electrical-energy meter shown in FIGS. 1-2D, after thewire pin has been inserted through the first and second PCBs and the PCBhousing, and into a pocket of the base; and

FIG. 4B is a cross-sectional side view of the first and second PCB, PCBhousing, base, contact blade, and wire pin shown in FIG. 4A, after thesecond PCB has been moved laterally in relation to the first PCB, PCBhousing, base, and contact blade to bend the wire pin.

DESCRIPTION OF PREFERRED METHODS

A preferred method for providing an electrical connection is describedherein. The preferred method, as described herein, is used to establishan electrical connection between a printed circuit board (PCB) 58 and anelectrically-conductive contact blade 74 of an electrical-energy meter14 (see FIG. 1). The preferred method is described in relation to theseparticular components for exemplary purposes only. The preferred methodcan be used to electrically connect other types of components, in othertypes of electrical devices or systems.

The electrical-energy meter 14 comprises a base 50, a current sensorassembly 52, and a power transformer 54 (see FIG. 1). The current sensorassembly 52 and the power transformer 54 are mounted on the base 50 byway of a retainer 56. The electrical-energy meter 14 also includes thePCB 58, a PCB housing 59, a name plate 62, and a digital display 63mounted on the name plate 62. The name plate 62 is mounted on snap posts64 formed in the base 50.

The current sensor assembly 52 comprises an annular current sensor 66,current conductors 68 that conduct electrical current to the currentsensor 66, and meter blades 69 connected to opposite ends of eachcurrent conductor 68. The meter blades 69 are retained in the base 50 byway of keyhole slots 70 formed in a major portion 50 a of the base 50.

Each of the meter blades 69 slidably and securely engages acorresponding receptacle (not shown) mounted on the residential orcommercial establishment in which the electrical-energy meter 14 isused. The engagement of the blades 69 and the corresponding receptacleselectrically couples the electrical-power meter 14 to the conductor thatsupplies electrical power to the residential or commercialestablishment.

The current sensor 66 is electrically coupled to the PCB 58, andmeasures the electrical current flowing through the electrical-powermeter 14 by way of the current conductors 68 and the meter blades 69.The meter blades 69 are electrically coupled to the PCB 58 through theoutput of the current sensor (66). The PCB 58 thus receives a voltageinput that is proportional to the voltage of the conductor that supplieselectrical power to the residential or commercial establishment. The PCB58 calculates the total (cumulative) watt-hours of power that havepassed through the electrical-energy meter 14 over time based on themeasured current and the voltage input, using conventional techniquesknown to those skilled in the field of electrical-energy meter design.The PCB 58 continually updates the cumulative watt-hours, and displaysthe updated value on the digital display 63.

The current sensor assembly 52, power transformer 54, PCB 58, name plate62, and digital display 63 are housed within a cover 72.

The electrical-energy meter 14 includes a plurality of the contactblades 74 (see FIGS. 1-2D; only one of the contact blades 74 is depictedin FIG. 1, for clarity). The contact blades 74 are mounted in slots 76formed in the major portion 50 a of the base 50. The contact blades 74are electrically connected to the PCB 58, as discussed below.

A first portion 74 a of each contact blade 74 extends downward (in the“−y” direction) from the major portion 50 a of the base 50 (from theperspective of FIGS. 2A-2D). The first portion slidably and securelyengages a corresponding receptacle (not shown) mounted on theresidential or commercial establishment in which the electrical-energymeter 14 is used. The engagement of the blades 74 and the correspondingreceptacle facilitates the transmission of electrical energy through theelectrical energy meter 14 to the residential or commercialestablishment.

Specific details of the electrical-energy meter 14 are presented forexemplary purposes only. The present invention can be applied to othertypes of electrical-energy meters, and to other types of devices andsystems.

The PCB 58 and the contact blades 74 are electrically connected using anelectrically-conductive wire pin 77 (see FIGS. 2A-2D). A first endportion 77 a of the wire pin 77 is positioned in a through hole 78formed in the PCB 58 when the wire pin 77 is in its installed position,i.e., in the position depicted in FIG. 2D. The through hole 78 isdefined by a surface 80 of the PCB 58. The through hole 78 is a platedthrough hole. In other words, the surface 80 is covered by anelectrically-conductive coating. The through hole 78 acts as a retainingfeature for the wire pin 77, as discussed below.

A second end portion 77 b of the wire pin 77 is positioned against thecontact blade 74 when the wire pin 77 is in its installed position.

The through hole 78 and the contact blade 74 are substantiallymisaligned with respect to the vertical (“y”) direction, i.e., thethrough hole 78 is offset from the contact blade 74 in the “x”direction, when the wire pin 77 is in its installed position. (Thefigures are referenced to a common coordinate system 82 depictedtherein.) This misalignment creates a contact force between the surface80 of the PCB 58 and the first end portion 77 a of the wire pin 77. Themisalignment also creates a contact force between the second end portion77 b of the wire pin 77 and the contact blade 74. The contact forceshelp to establish electrical contact between the wire pin 77 and the PCB58, and between the wire pin 77 and the contact blade 74. The contactforces also help to retain the wire pin 77 in its installed position.

Details relating to the installation of the wire pin 77 are as follows.

The PCB 58 is fixedly coupled to the PCB housing 59 by a suitable meanssuch as fasteners (not shown). The PCB housing 59 has a through hole 84formed therein. The through hole 84 is substantially aligned with thethrough hole 78 in the PCB 58.

A second portion 74 b of the contact blade 74 extends upward (in the“+y” direction) from the major portion 50 a of the base 50 (from theperspective of FIGS. 2A-2D. The base 50 includes a projection 86 thatextends upward from the major portion 50 a (the projection 86 is notshown in FIG. 1, for clarity). The projection 86 is located proximatethe second portion 74 b of the contact blade 74, and is offset from thesecond portion 74 b in the “x” direction. The projection 86 and thesecond portion 74 b define a pocket 88 therebetween. The pocket 88 actsas a retaining feature for the wire pin 77, as discussed below.

The wire pin 77 is installed by positioning the PCB 58 and the PCBhousing 59 as shown in FIG. 2A. In particular, the PCB 58 and the PCBhousing 59 are positioned so that the through holes 78, 84 arepositioned over, and substantially align with the pocket 88.

The wire pin 77 is subsequently inserted through the through holes 78,84, until the second end portion 77 b enters the pocket 88 and abuts themajor portion 50 a of the base 50 (the direction of insertion is denotedby the arrow 89 in FIG. 2A). (The wire pin 77 can be inserted manually,or by a suitable automated device. The wire pin 77 can also be insertedby dropping the wire pin 77 through the through holes 78, 84.) Therespective diameters of the wire pin 77 and the through holes 78, 84,and the width (“x” axis dimension) of the pocket 88 are preferablychosen so that the wire pin 77 can be freely inserted through thethrough holes 78, 84 and into the pocket 88.

The length of the wire pin 77 is preferably selected so that the wirepin 77 is positioned as shown in FIG. 2B when the wire pin 77 has beenfully inserted through the through holes 78, 84. In particular, thefirst end portion 77a is positioned within and above the through hole78, and below the through hole 84 when the wire pin 77 has been fullyinserted (from the perspective of FIG. 2B).

A force is subsequently exerted on the PCB housing 59 to move the PCBhousing 59 laterally, in the “−x” direction, in relation to the base 50.(The force can be exerted manually, or by a suitable automated device.)The PCB 58 is fixedly coupled to the PCB housing 59, as discussed above.The PCB 58 therefore moves with the PCB housing 59 (the direction ofmovement of the PCB 58 and the PCB housing 59 is denoted by the arrow 90in FIGS. 2B, 2C).

The surface 80 of the PCB 58 urges the first end portion 77 a of thewire pin 77 in the “−x” direction in response to the lateral movement ofthe PCB 58. The movement of the first end portion 77 a causes a middleportion 77 c of the wire pin 77 to contact an upper edge 86 a of theprojection 86, as shown in FIG. 2C.

The projection 86 restrains the middle portion 77 c so that furtherlateral movement of the PCB 58 in relation of the base 50 causes thesecond end portion 77 b to contact the second portion 74 b upper portion40 a of the contact blade 74 (see FIG. 2C). In other words, therestraining effect of the projection 86 causes the wire pin 77 to pivotabout the upper edge 86 a in a counterclockwise direction (from theperspective of FIGS. 2 b and 2C) until the second end portion 77b of thewire pin 77 contacts the second portion 74 b of the contact blade 74.

Further lateral movement of the PCB 58 urges the first end portion 77 aof the wire pin 77 in the “−x” direction, while the middle portion 77 cand the second end portion 77 b are restrained by the respectiveprojection 86 and contact blade 74. The physical properties and thelength to diameter (“L/D”) ratio of the wire pin 77 are preferablyselected so that the wire pin 77 can resiliently deflect (bend) inresponse to this combination of forces thereon, as shown in FIG. 2D.(The method provided by the present invention can be used in high or lowvoltage applications. Hence, the diameter of the wire pin 77 should alsobe selected on the basis of the current that is to be transmittedtherethrough.)

The PCB 58 is moved in the lateral (“−x”) direction until a side portion59 a of the PCB housing 59 substantially aligns with a correspondingside portion 50 b of the base 50 with respect to the vertical (“y”)direction, as shown in FIG. 2D. (The through hole 78 is substantiallymisaligned with the pocket 88 with respect to the vertical direction atthis point.) The side portions 59 a, 50 b can each be equipped withsuitable complementary locking features, such as latches 92, to securethe PCB housing 59 and the PCB 58 in position in relation to the base 50once the side portions 59 a, 50 b have been aligned.

The wire pin 77 forms an electrically-conductive path between the PCB 58and the contact blade 74. The resilience of the wire pin 77 helps toestablish a contact force between the surface 80 of the PCB 58 and thefirst end portion 77 a of the wire pin 77, and between the contact blade74 and the contact blade 74.

The contact forces help to establish (and enhance) the electricalcontact between the wire pin 77 and the PCB and contact blade 74. (Thefirst end portion 77 a contacts the surface 80 of the PCB 58 at twolocations due to the angled orientation of the first end portion 77 a inrelation to the PCB 58, as depicted in FIG. 2D. Redundant contact pointsare thus established between the wire pin 77 and the PCB 58.)

Friction between the first end portion 77 a of the wire pin 77 and thesurface 80 of the PCB 58, and between the second end portion 77 b andthe contact blade 74, it is believed, helps to retain the wire pin 77 inits installed position. (The through hole 78 and the pocket 88 thus actas retaining features that facilitate retention of the wire pin 77 inits installed position.)

The deflection of the wire pin 77 should be limited to values that causethe material from which the wire pin 77 is formed to remain within itselastic limit as the wire pin 77 deflects. The wire pin 77 thus behavesas a spring that exerts a contact force proportional to the deflectionthereof.

The contact force exerted by the wire pin 77 should be sufficient toestablish adequate electrical contact between the wire pin 77 and thePCB 58 and contact blade 74. The contact force should also be sufficientto adequately retain the wire pin 77 in its installed position.

The contact force exerted by the wire pin 77 is related to thelength-to-diameter ratio thereof, and to the hardness of the materialfrom which the wire pin 77 is formed. The wire pin 77 is preferablyformed from a material having relatively high hardness, conductivity,and corrosion resistance. For example, the wire pin 77 can be formedfrom non-annealed phosphor-bronze wire (the drawing process used to formwith phosphor-bronze material into wire is believed to provide thephosphor-bronze material with the requisite hardness for use in thisapplication). Alternatively, the wire pin 77 can be formed frommaterials such as stainless steel, copper, beryllium-copper, or othersuitable materials.

The preferred method (and variants thereof) can be used to establish anelectrical path between two or more components without the use ofsoldering or other conduction reflow processes. The preferred method, itis believed, does not require precise control of process variables, incontradistinction to conduction reflow processes. The preferred methodcan thus be implemented without the expense and complications associatedwith providing such control. Moreover, it is believed that the preferredmethod can be automated at a relatively low cost, thus making the use ofthe preferred method economically feasible for low-volume productionruns.

Electrical connections formed in accordance with the preferred methodcan be disassembled with relative ease, unlike connections formed usingsolder or adhesive. Electrical connections formed in accordance with thepreferred method are also believed to be more reliable than connectionsthat rely on the use of solder or adhesive.

The preferred method can be used in lieu of electrical connectors andconventional flexible wires, extended rigid pins and correspondingreceptacles, and spring arrays. The preferred method, it is believed,can provide electrical connections that are less expensive, have a lowerparts count and footprint, and require less assembly effort thanelectrical connections provided by the noted techniques.

It is believed that the electrical connections provided by the preferredmethod are more reliable than connections formed using electricalconnectors and conventional flexible wires, extended rigid pins andcorresponding receptacles, and spring arrays. Moreover, such techniquescan be difficult to automate. The preferred method, by contrast, canreadily be performed on an automated basis in both high and low-volumeproduction runs.

The foregoing description is provided for the purpose of explanation andis not to be construed as limiting the invention. While the inventionhas been described with reference to preferred embodiments or preferredmethods, it is understood that the words which have been used herein arewords of description and illustration, rather than words of limitation.Furthermore, although the invention has been described herein withreference to particular structure, methods, and embodiments, theinvention is not intended to be limited to the particulars disclosedherein, as the invention extends to all structures, methods and usesthat are within the scope of the appended claims. Those skilled in therelevant art, having the benefit of the teachings of this specification,may effect numerous modifications to the invention as described herein,and changes may be made without departing from the scope and spirit ofthe invention as defined by the appended claims.

Alternative methods within the scope of the present invention can beused to electrically connect two components having through holes formedtherein for receiving the respective first and second end portions 77 a,77 b of the wire pin 77. For example, an alternative version of thepreferred method can be used to connect two of the PCBs 10. The wire pin77 can be inserted through the through hole 78 of the upper PCB 58 sothat the second end portion 77 b of the wire pin 77 is positioned, inpart, within the through hole 78 of the lower PCB 58, and the first end77 a is positioned, in part, within the through hole 78 of the upper PCB58 (see FIG. 3A).

The lower PCB 58 is fixedly coupled to a PCB housing 94 that does nothave one of the through holes 84 formed therein (the PCB housing 94 thussupports the wire pin 77 when the wire pin 77 positioned as depicted inFIG. 3A). The upper PCB 58 and its associated PCB cover 59 can be movedlaterally. (in the “−x” direction) to bend the wire pin 77 as shown inFIG. 3B, thereby establishing a contact force between the wire pin 77and the upper and lower PCBs 58.

Other alternative methods within the scope of the present invention canbe used to electrically connect three or more components. For example,FIGS. 4A and 4B depict a wire pin 96 that interconnects two of the PCBs58 and one of the contact blades 74 (the wire pin 96 is longer than thewire pin 77, but is otherwise substantially identical to the wire pin77).

The wire pin 96 can be inserted through the through holes 78 in the PCBs58, until reaching the position depicted in FIG. 4A. The lower PCB 58can then be moved laterally (in the “−x” direction) to cause the wirepin 96 to resiliently deflect, thereby establishing contact forcesbetween the wire pin 96 and the PCBs 10 and contact blade 74 (see FIG.4B). (The lower PCB 58 does not have an associated PCB housing in thisparticular embodiment.)

1. A method for electrically connecting a component and a printedcircuit board, comprising: inserting a wire pin through a first throughhole formed in the component so that a first portion of the wire pin islocated within the first through hole and a second portion of the wirepin is located within a second through hole formed in the printedcircuit board; and moving one of the component and the printed circuitboard in relation to the other of the component and the printed circuitboard so that the wire pin resiliently deflects thereby establishing afirst contact force between the first portion of the wire pin and thecomponent, and a second contact force between the second portion of thewire pin and the printed circuit board.
 2. The method of claim 1,wherein the component is a printed circuit board.
 3. The method of claim2, wherein the component is a printed circuit board of anelectrical-energy meter.
 4. The method of claim 1, wherein inserting awire pin through a first through hole formed in the component comprisesinserting the wire pin in a first direction, and moving one of thecomponent and the printed circuit board in relation to the other of thecomponent and the printed circuit board comprises moving the one of thecomponent and the printed circuit board in relation to the other of thecomponent and the printed circuit board in a second directionsubstantially perpendicular to the first direction.
 5. The method ofclaim 1, wherein moving one of the component and the printed circuitboard in relation to the other of the component and the printed circuitboard so that the wire pin resiliently deflects comprises moving one ofthe component and the printed circuit board in relation to the other ofthe component and the printed circuit board so that the wire pin bends.6. The method of claim 1, further comprising substantially aligning thefirst and second through holes before inserting the wire pin.
 7. Themethod of claim 6, wherein the moving one of the component and theprinted circuit board in relation to the other of the component and theprinted circuit board so that the wire pin resiliently deflectscomprises substantially misaligning the first and second through holes.8. The method of claim 1, wherein the first through hole is a platedthrough hole and the first contact force is established between thefirst portion of the wire and plating of the first through hole.
 9. Themethod of claim 1, further comprising locking the one of the componentand the printed circuit board in position in relation to the other ofthe component and printed circuit board after moving the one of thecomponent and the printed circuit board in relation to the other of thecomponent and the printed circuit board.
 10. The method of claim 1,wherein inserting a wire pin through a first through hole formed in thecomponent comprises dropping the wire pin through the first throughhole.
 11. The method of claim 1, wherein moving one of the component andthe printed circuit board in relation to the other of the component andthe printed circuit board so that the wire pin resiliently deflectscomprises moving the one of the component and the printed circuit boardin relation to the other of the component and the printed circuit boardso that the first portion of the wire is restrained by the component andthe second portion of the wire is restrained by the printed circuitboard thereby causing the first portion of the wire to move in relationto the second portion of the wire in response to the movement of thecomponent in relation to the printed circuit board.
 12. A method forelectrically connecting a first and a second component, comprising:substantially aligning a first through hole formed in the firstcomponent with a second through hole formed in the second component;inserting a wire pin through the first through hole in a first directionso that a first portion of the wire pin is located within the firstthrough hole and a second portion of the wire pin is located within thesecond through hole; and moving one of the first and the secondcomponents in a second direction in relation to the other of the firstand the second components, the second direction being substantiallyperpendicular to the first direction, thereby causing one of the firstand second portions of the wire pin to move in relation to the other ofthe first and second portions of the wire pin.
 13. The method of claim12, wherein the first component is a printed circuit board.
 14. Themethod of claim 13, wherein the first component is a printed circuitboard of an electrical-energy meter.
 15. The method of claim 12, whereinthe second component is a printed circuit board.
 16. The method of claim15, wherein the second component is a printed circuit board of anelectrical-energy meter.
 17. The method of claim 12, wherein moving oneof the first and the second components in a second direction in relationto the other of the first and the second components comprises moving oneof the first and the second components in a second direction in relationto the other of the first and the second components so that the wire pinresiliently deflects thereby establishing a contact force between thewire pin and the first and second components.
 18. The method of claim12, wherein moving one of the first and the second components in asecond direction in relation to the other of the first and the secondcomponents comprises moving the one of the first and the secondcomponents in relation to the other of the first and the secondcomponents so that the first portion of the wire is restrained by thefirst component and the second portion of the wire is restrained by thesecond component thereby causing the first portion of the wire to movein relation to the second portion of the wire.